Invention Grant
- Patent Title: Semiconductor device structure and method for forming the same
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Application No.: US15821969Application Date: 2017-11-24
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Publication No.: US10340190B2Publication Date: 2019-07-02
- Inventor: Wei-Hao Lu , Yi-Fang Pai , Tuoh-Bin Ng , Li-Li Su , Chii-Horng Li
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L27/088 ; H01L29/04 ; H01L29/08 ; H01L29/167 ; H01L29/45 ; H01L21/02 ; H01L23/535 ; H01L29/78

Abstract:
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a first fin structure and a second fin structure over a substrate. The semiconductor device structure also includes a gate structure over the first and second fin structure. The semiconductor device structure further includes a source/drain structure over the first and second fin structure. The source/drain structure includes a first semiconductor layer over the first fin structure and a second semiconductor layer over the second fin structure. The source/drain structure also includes a third semiconductor layer covering the first and second semiconductor layers. The third semiconductor layer has a surface with [110] plane orientation.
Public/Granted literature
- US20190164835A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2019-05-30
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