Invention Grant
- Patent Title: Via formation using directed self-assembly of a block copolymer
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Application No.: US15703097Application Date: 2017-09-13
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Publication No.: US10340179B2Publication Date: 2019-07-02
- Inventor: Cheng Chi , Kafai Lai , Chi-Chun Liu , Yongan Xu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/311 ; H01L21/768
Abstract:
A method of forming an interconnect element includes forming a trench in a dielectric material. The trench has a width equal to twice a natural pitch of a block copolymer. The block copolymer includes a first polymer and a second polymer. The method includes filling the trench with the block copolymer.
Public/Granted literature
- US20190080958A1 VIA FORMATION USING DIRECTED SELF-ASSEMBLY OF A BLOCK COPOLYMER Public/Granted day:2019-03-14
Information query
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