Invention Grant
- Patent Title: Device for prefixing of substrates
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Application No.: US15535082Application Date: 2014-12-23
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Publication No.: US10340161B2Publication Date: 2019-07-02
- Inventor: Friedrich Paul Lindner
- Applicant: EV Group E. Thallner GmbH
- Applicant Address: AT St. Florian am Inn
- Assignee: EV Group E. Thallner GmbH
- Current Assignee: EV Group E. Thallner GmbH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kusner & Jaffe
- International Application: PCT/EP2014/079110 WO 20141223
- International Announcement: WO2016/101992 WO 20160630
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; H01L21/20 ; H01L21/3205 ; H01L21/68 ; H01L21/60
Abstract:
A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.
Public/Granted literature
- US20170345690A1 METHOD AND DEVICE FOR PREFIXING OF SUBSTRATES Public/Granted day:2017-11-30
Information query
IPC分类:
