Invention Grant
- Patent Title: Method of forming a semiconductor die cutting tool
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Application No.: US14885804Application Date: 2015-10-16
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Publication No.: US10340160B2Publication Date: 2019-07-02
- Inventor: Gordon M. Grivna , John M. Parsey, Jr.
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Robert F. Hightower
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/78 ; B28D5/00 ; B23P15/28
Abstract:
In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to be formed in the semiconductor wafer.
Public/Granted literature
- US20160035599A1 METHOD OF FORMING A SEMICONDUCTOR DIE CUTTING TOOL Public/Granted day:2016-02-04
Information query
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