Invention Grant
- Patent Title: Mechanical couplings designed to resolve process constraints
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Application No.: US15857988Application Date: 2017-12-29
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Publication No.: US10340152B1Publication Date: 2019-07-02
- Inventor: Yuh-Harng Chien , Hung-Yu Chou , Fu-Kang Lee , Steven Alfred Kummerl
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48
Abstract:
An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.
Public/Granted literature
- US20190206699A1 MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS Public/Granted day:2019-07-04
Information query
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