Invention Grant
- Patent Title: Substrate processing apparatus, heating apparatus, ceiling heat insulator, and method of manufacturing semiconductor device
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Application No.: US14615073Application Date: 2015-02-05
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Publication No.: US10340151B2Publication Date: 2019-07-02
- Inventor: Tetsuya Kosugi , Motoya Takewaki , Masaaki Ueno , Hitoshi Murata
- Applicant: HITACHI KOKUSAI ELECTRIC INC.
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2014-021223 20140206
- Main IPC: H01L21/324
- IPC: H01L21/324 ; H01L21/67
Abstract:
A ceiling heat insulator installed above a side wall heat insulator of a heating apparatus for a substrate processing apparatus for processing a substrate is provided. The ceiling heat insulator includes a gas-flow path installed therein to allow a cooling gas to pass therethrough so that the ceiling heat insulator has a solid cross-sectional area in an outer edge side of the ceiling heat insulator that is smaller than that in a center side of the ceiling heat insulator.
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