Invention Grant
- Patent Title: Electric wire bundle, apparatus for manufacturing electric wire bundle, and method for manufacturing electric wire bundle
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Application No.: US15559585Application Date: 2016-03-16
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Publication No.: US10340062B2Publication Date: 2019-07-02
- Inventor: Satoshi Endo , Shigeto Kato
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie JP Mie JP Osaka
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie JP Mie JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2015-066203 20150327
- International Application: PCT/JP2016/058240 WO 20160316
- International Announcement: WO2016/158399 WO 20161006
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01B13/012 ; H01B13/26 ; B65B27/10 ; H01B7/282 ; H01B7/36 ; H02G3/30 ; H02G3/04

Abstract:
An object of the present invention is to make it easy to bind a plurality of electric wires together. An electric wire bundle includes an electric wire group and a binding portion. The electric wire group includes a bundle portion in which at least a portion of a plurality of electric wires in an extension direction is bundled together. The binding portion formed by supplying a fluid binding portion forming material to an outer circumferential portion of the bundle portion in strip-shape in a form in which the bundle portion can be maintained in a bundled state and curing the binding portion forming material. Such a bundle can be formed by discharging the fluid binding portion forming material from a nozzle to the circumference of a bundle portion of a plurality of electric wires supported by an electric wire supporting portion, and curing the fluid binding portion forming material.
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