Invention Grant
- Patent Title: Pressure sensitive adhesive composition and pressure sensitive adhesive pattern formed therfrom
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Application No.: US15893267Application Date: 2018-02-09
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Publication No.: US10336924B2Publication Date: 2019-07-02
- Inventor: Joong Han Kum , Jeong Ho Yoo , Kyoung Moon Jung , Bong Jin Choi , Han Young Choi
- Applicant: DONGWOO FINE-CHEM CO., LTD.
- Applicant Address: KR Jeollabuk-Do
- Assignee: Dongwoo Fine-Chem Co., Ltd.
- Current Assignee: Dongwoo Fine-Chem Co., Ltd.
- Current Assignee Address: KR Jeollabuk-Do
- Agency: DLA Piper LLP (US)
- Priority: KR10-2017-0017951 20170209
- Main IPC: G03F7/027
- IPC: G03F7/027 ; G03F7/033 ; G03F7/038 ; C09J133/08

Abstract:
An pressure sensitive adhesive composition according to the present invention includes: an acrylic copolymer; a multifunctional acrylate-based compound; and a photoinitiator, in which the acrylic copolymer includes a repeating unit derived from an acrylate-based monomer having a Tg of −20° C. or less and a repeating unit derived from an unsaturated carboxylic acid monomer, and the repeating unit derived from the unsaturated carboxylic acid monomer is included in an amount of 10 to 50 parts by weight based on the total 100 parts by weight of the acrylic copolymer.
Public/Granted literature
- US20180223138A1 PRESSURE SENSITIVE ADHESIVE COMPOSITION AND PRESSURE SENSITIVE ADHESIVE PATTERN FORMED THERFROM Public/Granted day:2018-08-09
Information query
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