Invention Grant
- Patent Title: Adhesive composition
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Application No.: US15560917Application Date: 2016-03-24
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Publication No.: US10336919B2Publication Date: 2019-07-02
- Inventor: Jung Sup Shim , Seung Min Lee , So Young Kim , Se Woo Yang
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2015-0040740 20150324
- International Application: PCT/KR2016/003004 WO 20160324
- International Announcement: WO2016/153294 WO 20160929
- Main IPC: C09J123/00
- IPC: C09J123/00 ; C09J133/00 ; C09J163/00 ; C08L33/04 ; C08L63/00 ; C08L75/04 ; C08L101/02 ; B33Y70/00 ; B32B37/00 ; C09J123/22 ; C08L23/22 ; H01L21/3105
Abstract:
Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and an OED including the same.
Public/Granted literature
- US20180051193A1 ADHESIVE COMPOSITION Public/Granted day:2018-02-22
Information query
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