Invention Grant
- Patent Title: Methods for placing an EMV chip onto a metal card
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Application No.: US15422784Application Date: 2017-02-02
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Publication No.: US10336126B2Publication Date: 2019-07-02
- Inventor: Jonny B. Vu
- Applicant: Jonny B. Vu
- Main IPC: B29C35/02
- IPC: B29C35/02 ; B29C53/04 ; B29C53/84 ; B42D25/47 ; G06K19/02 ; G06K19/04 ; B42D25/305 ; B42D25/373 ; G06K19/077

Abstract:
A method for removing an EMV chip from a plastic credit card or debit card and placing the removed EMV chip onto a metal card, includes heating the plastic credit or debit card containing the EMV chip to loosen the EMV chip, the EMV chip being substantially square and planar, the EMV chip having an upward top face, a downward bottom face, and four sides; removing the loosened EMV chip from the plastic credit or debit card; bending the four sides of the EMV chip towards the downward bottom face of the EMV chip; applying an adhesive coating to the bottom face and the bended four sides of the EMV chip; and placing the adhesive coated bottom face and bended four sides of the EMV chip into a holding cavity of the metal card.
Public/Granted literature
- US20180281503A1 METHODS FOR PLACING AN EMV CHIP ONTO A METAL CARD Public/Granted day:2018-10-04
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