Invention Grant
- Patent Title: Multiple nozzle slurry dispense scheme
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Application No.: US14179348Application Date: 2014-02-12
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Publication No.: US10335920B2Publication Date: 2019-07-02
- Inventor: Chih-Hsuan Hsieh , Tseng-Hsuan Huang , Chen-Hsiang Liao
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company
- Current Assignee: Taiwan Semiconductor Manufacturing Company
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: B24B57/02
- IPC: B24B57/02 ; B24B37/34 ; B24B53/017
Abstract:
An apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm. The slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
Public/Granted literature
- US20150224626A1 Multiple Nozzle Slurry Dispense Scheme Public/Granted day:2015-08-13
Information query
