Invention Grant
- Patent Title: Methods and devices for dicing components from a sheet of copper alloy
-
Application No.: US15165578Application Date: 2016-05-26
-
Publication No.: US10335875B2Publication Date: 2019-07-02
- Inventor: Wan Mohd Misuari Suleiman
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Charles A. Brill; Frank D. Cimino
- Main IPC: B23D61/02
- IPC: B23D61/02 ; B24B27/06 ; H01C17/245 ; B23D45/00 ; B23D45/02 ; H01C7/00
Abstract:
A saw blade for dicing a sheet of copper alloy to form individual resistors is disclosed, wherein the sheet of copper alloy has a thickness of less than 0.3 mm. The saw blade includes a ring having a first side, a second side, and a circumferential surface, wherein the thickness of the ring between the first side and the second side is less than 0.6 mm.
Public/Granted literature
- US20170341170A1 METHODS AND DEVICES FOR DICING COMPONENTS FROM A SHEET OF COPPER ALLOY Public/Granted day:2017-11-30
Information query
