Invention Grant
- Patent Title: Method for producing a chassis member usable in a chassis of an electronic device
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Application No.: US15435061Application Date: 2017-02-16
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Publication No.: US10285294B2Publication Date: 2019-05-07
- Inventor: Tsunenori Yanagisawa
- Applicant: LENOVO (SINGAPORE) PTE. LTD.
- Applicant Address: SG Singapore
- Assignee: LENOVO (SINGAPORE) PTE LTD
- Current Assignee: LENOVO (SINGAPORE) PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Russell Ng PLLC
- Agent Antony P. Ng
- Priority: JP2016-026773 20160216
- Main IPC: H05K5/04
- IPC: H05K5/04 ; C25D11/04 ; C25D11/18 ; C25D11/02 ; C23F15/00 ; C25D11/16 ; G06F1/18 ; H05K5/00 ; H01L33/48 ; C23F1/00 ; G06F1/16
Abstract:
A chassis member for a chassis of an electronic device is disclosed. The chassis member includes an aluminum alloy layer and an alumite layer serving as an outermost layer of the chassis member and disposed on a surface of the aluminum alloy layer. A grain size of an aluminum alloy in the aluminum alloy layer is between 40 μm and 50 μm.
Public/Granted literature
- US20170235336A1 METHOD FOR PRODUCING A CHASSIS MEMBER USABLE IN A CHASSIS OF AN ELECTRONIC DEVICE Public/Granted day:2017-08-17
Information query
