Invention Grant
- Patent Title: Circuit structure
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Application No.: US15545120Application Date: 2016-01-13
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Publication No.: US10285274B2Publication Date: 2019-05-07
- Inventor: Arinobu Nakamura , Tou Chin
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka
- Agency: Honigman LLP
- Priority: JP2015-019385 20150203
- International Application: PCT/JP2016/050749 WO 20160113
- International Announcement: WO2016/125543 WO 20160811
- Main IPC: H05K1/05
- IPC: H05K1/05 ; H05K1/18 ; H05K1/02

Abstract:
A circuit structure is provided to which an electronic component can be easily mounted (electrical connection of terminals). A circuit structure that includes a substrate provided with a conductive pattern on one face thereof; a conductive member fixed to the other face of the substrate; an electronic component that has first terminals and of a plurality of terminals, that are electrically connected to the conductive member, and a second terminal of the plurality of terminals that is electrically connected to the conductive pattern provided on the substrate; and a relay member for electrically connecting the second terminal and the conductive pattern provided on the substrate, at least a portion of the relay member being fixed to the conductive member via an insulating material.
Public/Granted literature
- US20170367189A1 CIRCUIT STRUCTURE Public/Granted day:2017-12-21
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