- Patent Title: Solder alloy free electronic (safe) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture
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Application No.: US13573309Application Date: 2012-09-07
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Publication No.: US10285270B2Publication Date: 2019-05-07
- Inventor: Joseph Fjelstad
- Applicant: Joseph Fjelstad
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14 ; H05K1/18 ; H05K3/00 ; H05K3/44 ; H05K3/46
Abstract:
A rigid flex circuit comprised of high thermal conductivity sections, said sections having components disposed so as to have their contacts substantially planar with the surface of the thermally conductive section and wherein the contacts are interconnected directly to the traces without the use of solder and further having the thermally conductive sections interconnected to one another by means of flexible circuit sections.
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