Invention Grant
- Patent Title: Multilayer substrate and manufacturing method for the multilayer substrate
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Application No.: US14845349Application Date: 2015-09-04
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Publication No.: US10285269B2Publication Date: 2019-05-07
- Inventor: Kuniaki Yosui
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-184664 20130906
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/11 ; H05K3/46 ; B32B37/06 ; B32B37/10 ; H05K1/02 ; H05K1/03 ; H05K3/06 ; H05K3/12 ; B32B37/02 ; B32B37/18 ; B32B7/04 ; B32B27/08 ; B32B27/28 ; B32B7/03

Abstract:
A multilayer substrate is manufactured by first manufacturing a first substrate by stacking and hot-pressing resin base materials of the first substrate and then adjacently stacking and hot-pressing the first substrate and resin base materials that constitute a second substrate at a position overlapping with each other in a stacking direction. The position in the stacking direction between the resin base materials in the first substrate is located at almost a middle position in the stacking direction of a resin base material of the second substrate, and is different from the position between the layers of the resin base materials of the second substrate.
Public/Granted literature
- US20150382464A1 MULTILAYER SUBSTRATE AND MANUFACTURING METHOD FOR THE MULTILAYER SUBSTRATE Public/Granted day:2015-12-31
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