A power converter (1) includes: planar semiconductor modules (10) each having a resin sealing part (16) in which a semiconductor element (11), conductive members (12, 13, and 14), and a signal terminal (15) are sealed with a resin; a cooler (20) that holds the plurality of semiconductor modules (10) in a laminated manner; and a cover (30) that covers the semiconductor modules and the cooler, wherein at least a part of the resin sealing part (16) and the cooler (20) are supported by support media (41 and 42) that extend from the cover (30) so that facing parts of the resin sealing part and the cooler with respect to the cover (30) is positioned in proximity to the cover, and the conductive members and the signal terminal protrude from the resin sealing part in a direction away from the cover.