Invention Grant
- Patent Title: Thermally conductive ring assemblies suitable for load centers
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Application No.: US16167868Application Date: 2018-10-23
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Publication No.: US10283943B2Publication Date: 2019-05-07
- Inventor: James Gerard Maloney
- Applicant: Eaton Intelligent Power Limited
- Applicant Address: IE Dublin
- Assignee: Eaton Intelligent Power Limited
- Current Assignee: Eaton Intelligent Power Limited
- Current Assignee Address: IE Dublin
- Agency: Myers Bigel, P.A.
- Main IPC: H02B1/21
- IPC: H02B1/21 ; H01H1/38 ; H02B1/056 ; H02G3/14 ; F28F21/08 ; F28F21/04 ; H02B1/06 ; H01H71/00 ; H05K1/02 ; H02B1/56

Abstract:
Thermally conductive assemblies that provide a heat conduction path include at least one thermally conductive inner member with longitudinally opposing first and second ends and an open center channel and an outer member surrounding the at least one thermally conductive inner member. The outer member is sufficiently flexible to expand outward in response to an outward force applied by the at least one thermally conductive inner member. The at least one inner member can be a plurality of cooperating inner members that have inner surfaces that align to form an inner perimeter surrounding the open center channel.
Public/Granted literature
- US20190058309A1 THERMALLY CONDUCTIVE RING ASSEMBLIES SUITABLE FOR LOAD CENTERS Public/Granted day:2019-02-21
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