Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
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Application No.: US15747774Application Date: 2016-07-26
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Publication No.: US10283645B2Publication Date: 2019-05-07
- Inventor: Fumiki Nakano , Sumio Katoh
- Applicant: Sharp Kabushiki Kaisha
- Applicant Address: JP Sakai
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Sakai
- Agency: Keating & Bennett, LLP
- Priority: JP2015-147710 20150727
- International Application: PCT/JP2016/071888 WO 20160726
- International Announcement: WO2017/018416 WO 20170202
- Main IPC: H01L29/786
- IPC: H01L29/786 ; G02F1/1368 ; G02F1/1362 ; H01L27/12 ; H01L29/423 ; H01L29/417

Abstract:
A semiconductor device includes a TFT (101), the TFT including a gate electrode (12), a gate insulating layer (14) covering the gate electrode, a metal oxide layer (16A) including a channel region (16c), a source contact region (16s) and a drain contact region (16d), a first electrode (18A) in contact with the source contact region, an insulating layer (22) formed on the metal oxide layer and the first electrode, the insulating layer having a first opening (22p) therein through which a portion of the metal oxide layer is exposed, and a light-transmissive second electrode (24) formed on the insulating layer and in a contact hole including the first opening, wherein the second electrode (24) is in contact with the drain contact region (16d) in the contact hole, the drain contact region (16d) is a portion of a region (17) of the metal oxide layer (16A) that is exposed through the contact hole, and as seen from a direction normal to a substrate (11), the second electrode (24) does not overlap the channel region (16c).
Public/Granted literature
- US20180226512A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2018-08-09
Information query
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