Invention Grant
- Patent Title: Metal gate scheme for device and methods of forming
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Application No.: US15859947Application Date: 2018-01-02
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Publication No.: US10283619B2Publication Date: 2019-05-07
- Inventor: Chung-Chiang Wu , Chia-Ching Lee , Da-Yuan Lee , Hsueh Wen Tsau
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/28 ; H01L29/49 ; H01L21/8238 ; H01L29/78 ; H01L29/51 ; H01L29/165

Abstract:
Gate structures and methods of forming the gate structures are described. In some embodiments, a method includes forming source/drain regions in a substrate, and forming a gate structure between the source/drain regions. The gate structure includes a gate dielectric layer over the substrate, a work function tuning layer over the gate dielectric layer, a metal-containing compound over the work function tuning layer, and a metal over the metal-containing compound, wherein the metal-containing compound comprises the metal as an element of the compound.
Public/Granted literature
- US20180145151A1 Metal Gate Scheme for Device and Methods of Forming Public/Granted day:2018-05-24
Information query
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