Invention Grant
- Patent Title: Solid-state imaging element and imaging device
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Application No.: US15746054Application Date: 2016-10-14
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Publication No.: US10283544B2Publication Date: 2019-05-07
- Inventor: Yuhi Yorikado , Atsushi Toda , Susumu Inoue
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP2015-236329 20151203
- International Application: PCT/JP2016/080501 WO 20161014
- International Announcement: WO2017/094362 WO 20170608
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/146 ; G02B3/00 ; H01L31/107 ; H04N5/374 ; H04N5/359 ; H01L31/0224 ; H01L31/0232

Abstract:
To improve detection efficiency in a solid-state imaging element including a SPAD in which an electrode and wiring are placed in a central portion.A solid-state imaging element includes a photodiode and a light collecting section. The photodiode includes a light receiving surface and an electrode placed on the light receiving surface, and that outputs an electrical signal in accordance with light incident on the light receiving surface in a state where a voltage exceeding a breakdown voltage is applied to the electrode. The light collecting section causes light from a subject to be collected in the light receiving surface other than a region where the electrode is placed.
Public/Granted literature
- US20180211990A1 SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE Public/Granted day:2018-07-26
Information query
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