A semiconductor package includes a package substrate, semiconductor chips stacked on the package substrate, and electrical connectors that connect internal circuitry of each of the chips to the package substrate. Each of the semiconductor chips includes a chip selection pad for transmitting a chip selection signal to the internal circuitry of the semiconductor chip and a chip dummy pad, electrically isolated from the internal circuitry, along a first side of the semiconductor chip. The electrical connectors include a lower chip connector that electrically connects the package substrate to the chip selection pad of the lower semiconductor chip, a first auxiliary connector that electrically connects the package substrate to the chip dummy pad of the lower semiconductor chip, and a second auxiliary connector that electrically connects the chip dummy pad of the lower semiconductor chip to the chip selection pad of the upper semiconductor chip.