Invention Grant
- Patent Title: Semiconductor device including conductive bump interconnections
-
Application No.: US15617867Application Date: 2017-06-08
-
Publication No.: US10283485B2Publication Date: 2019-05-07
- Inventor: Junrong Yan , Xiaofeng Di , Chee Keong Chin , Kim Lee Bock , Mingxia Wu
- Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.
- Current Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Vierra Magen Marcus LLP
- Priority: CN201710343078 20170516
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L25/00 ; H01L21/56 ; H01L21/78 ; H01L21/304 ; H01L21/288 ; H01L21/66
Abstract:
A semiconductor device is disclosed including semiconductor die stacked in a stepped, offset configuration, where die bond pads of semiconductor die on different levels are interconnected using one or more conductive bumps.
Public/Granted literature
- US20180337161A1 SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMP INTERCONNECTIONS Public/Granted day:2018-11-22
Information query
IPC分类:
