A packaging method and package structure for an image sensing chip are provided. The method includes: providing a wafer including a first surface and a second surface opposite to the first surface, where the wafer has multiple image sensing chips arranged in a grid, each having an image sensing region and contact pads arranged on a side of the first surface of the wafer; forming openings extending towards the first surface on the second surface of the wafer, to expose the contact pads; forming V-shaped cutting trenches extending towards the first surface on the second surface of the wafer; and applying a photosensitive ink on the second surface of the wafer, to completely fill the V-shaped cutting trenches, cover the openings, and form a hollow cavity between each of the openings and the photosensitive ink.