Invention Grant
- Patent Title: Electronic device, method for manufacturing the electronic device, and electronic apparatus
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Application No.: US15299339Application Date: 2016-10-20
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Publication No.: US10283434B2Publication Date: 2019-05-07
- Inventor: Taiji Sakai , Seiki Sakuyama , Nobuhiro Imaizumi , Aki Dote
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2015-216323 20151104
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/40 ; H01L23/40 ; H01L25/04 ; H01L25/065 ; H01L25/075 ; H01L25/11 ; H01L23/00 ; H05K1/00

Abstract:
An electronic device includes: a first circuit board; a second circuit board located above a first region of the first circuit board; a first semiconductor element located above a second region of the first circuit board, which is different from the first region, and above a third region of the second circuit board; a first connection interposed between the first semiconductor element and the second region so as to electrically interconnect the first semiconductor element and the first circuit board; and a second connection interposed between the first semiconductor element and the third region so as to electrically interconnect the first semiconductor element and the second circuit board.
Public/Granted literature
- US20170125359A1 ELECTRONIC DEVICE, METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2017-05-04
Information query
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