- Patent Title: Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink
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Application No.: US15504763Application Date: 2015-08-24
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Publication No.: US10283431B2Publication Date: 2019-05-07
- Inventor: Nobuyuki Terasaki , Yoshiyuki Nagatomo
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP2014-171901 20140826; JP2015-161293 20150818
- International Application: PCT/JP2015/073720 WO 20150824
- International Announcement: WO2016/031770 WO 20160303
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L21/48 ; H01L25/07 ; H01L25/18 ; H01L23/473
Abstract:
The present invention is a bonded body in which an aluminum member constituted by an aluminum alloy, and a metal member constituted by copper, nickel, or silver are bonded to each other. The aluminum member is constituted by an aluminum alloy in which a Si concentration is set to be in a range of 1 mass % to 25 mass %. A Ti layer is formed at a bonding portion between the aluminum member and the metal member, and the aluminum member and the Ti layer, and the Ti layer and the metal member are respectively subjected to solid-phase diffusion bonding.
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