Invention Grant
- Patent Title: Substrate placing table
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Application No.: US15521217Application Date: 2015-09-17
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Publication No.: US10283398B2Publication Date: 2019-05-07
- Inventor: Atsushi Tanaka , Ryohei Ogawa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2014-222039 20141030
- International Application: PCT/JP2015/076423 WO 20150917
- International Announcement: WO2016/067785 WO 20160506
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/687 ; H01L21/3065 ; H01L21/67 ; H01L21/311
Abstract:
A substrate placing table, which is installed inside a processing container for processing a wafer, includes: a stage configured to place a water on an upper surface thereof and including an inner peripheral flow channel and an outer peripheral flow channel formed therein to circulate a heat medium of a predetermined temperature therethrough; a support table configured to support the stage; and a temperature adjusting plate installed between the stage and the support table, and including a temperature adjusting mechanism configured to adjust a temperature of a heat radiation portion at which heat is radiated between the stage and the support table.
Public/Granted literature
- US20170352576A1 SUBSTRATE PLACING TABLE Public/Granted day:2017-12-07
Information query
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