Invention Grant
- Patent Title: Capacitor and substrate module
-
Application No.: US15906454Application Date: 2018-02-27
-
Publication No.: US10283277B2Publication Date: 2019-05-07
- Inventor: Tatsuya Fukunaga
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2017-056792 20170323; JP2017-219866 20171115
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01G4/38 ; H01G4/30 ; H01G4/228 ; H01G4/32 ; H01G4/005

Abstract:
A substrate module includes capacitors, a first coupling conductor, and a mounting substrate. The first coupling conductor couples two of the capacitors together. The mounting substrate includes a first power supply layer and a second power supply layer. The capacitors each include a first electrode, a second electrode, a first terminal conductor, a second terminal conductor, and a third terminal conductor. The first terminal conductor is coupled to the first electrode and to the first power supply layer. The second terminal conductor is coupled to the second electrode and to the second power supply layer. The third terminal conductor is coupled to the first coupling conductor. The third terminal conductor is coupled to the first electrode at a coupling position that is different from a coupling position of the first terminal conductor.
Public/Granted literature
- US20180277307A1 CAPACITOR AND SUBSTRATE MODULE Public/Granted day:2018-09-27
Information query