A multilayer ceramic capacitor having inner electrodes containing at least one metal selected from Cu, Ag, Pd, Pt, Rh, Ir, Ru, and Os in an amount of 0.1 atom % or more that is dissolved in Ni and Sn to form a solid solution. The percentage of Sn with respect to the total amount of Ni and Sn in near-surface regions each located at a depth of 2 nm from a surface of the inner electrode in contact with an adjacent ceramic dielectric layer is 1.4 or more atom %, and X−Y≥1.0, where X represents the atomic percentage of Sn in the near-surface regions and Y represents the atomic percentage of Sn in mid-thickness regions of the inner electrodes. A method for producing a multilayer ceramic capacitor includes annealing the ceramic multilayer body to increase, in the inner electrodes, the percentage of Sn in the near-surface regions.