Invention Grant
- Patent Title: Electronic component and component-embedded substrate
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Application No.: US15182066Application Date: 2016-06-14
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Publication No.: US10283270B2Publication Date: 2019-05-07
- Inventor: Tomokazu Nakashima , Masayuki Itoh , Yoshinori Mesaki
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2015-141196 20150715
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01G4/248 ; H01G4/30 ; H01G4/005 ; H01G4/12 ; H05K3/46
Abstract:
An electronic component includes: a component body into which elements are built; and a metal plate electrode that is joined to the component body by conductive paste so as to be electrically coupled to the elements, wherein the metal plate electrode exceeds in size a surface of the component body onto which the conductive paste is deposited.
Public/Granted literature
- US20170019999A1 ELECTRONIC COMPONENT AND COMPONENT-EMBEDDED SUBSTRATE Public/Granted day:2017-01-19
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