Invention Grant
- Patent Title: Multilayer capacitor and board having the same
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Application No.: US15260475Application Date: 2016-09-09
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Publication No.: US10283268B2Publication Date: 2019-05-07
- Inventor: Min Cheol Park , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR10-2015-0172246 20151204
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01G4/018 ; H05K1/18 ; H01G4/30 ; H01G4/35 ; H01G4/232 ; H01G4/005 ; H05K3/34

Abstract:
A multilayer capacitor includes a capacitor body including a first capacitance forming region and a second capacitance forming region disposed to face each other with a connection region of a predetermined thickness in which an internal electrode is not formed disposed therebetween, a thickness of the first capacitance forming region being greater than a thickness of the second capacitance forming region. The first capacitance forming region includes first and second internal electrodes. The second capacitance forming region includes a third and fourth internal electrodes. The connection region includes at least one dummy electrode disposed to have a shorter average distance to the first capacitance forming region than to the second capacitance forming region.
Public/Granted literature
- US20170164466A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME Public/Granted day:2017-06-08
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