Invention Grant
- Patent Title: High-aspect ratio structure production method, ultrasonic probe production method using same, and high-aspect ratio structure
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Application No.: US15428262Application Date: 2017-02-09
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Publication No.: US10283229B2Publication Date: 2019-05-07
- Inventor: Mitsuru Yokoyama , Yuko Yoshida
- Applicant: Konica Minolta, Inc.
- Applicant Address: JP Tokyo
- Assignee: KONICA MINOLTA, INC.
- Current Assignee: KONICA MINOLTA, INC.
- Current Assignee Address: JP Tokyo
- Agency: Lucas & Mercanti, LLP
- Priority: JP2016-050408 20160315
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C25D11/00 ; G21K1/06 ; C25D11/02 ; G01N29/22 ; G01N29/24 ; G03F7/16 ; G03F7/20 ; G03F7/26 ; C25D1/00 ; C25D1/10 ; G21K1/02 ; H01L41/18 ; H01L41/333 ; G01N23/20 ; H01L41/187

Abstract:
A high-aspect ratio structure production method and an ultrasonic probe production method of the present invention include: forming, in a principal surface of a substrate, a plurality of pores each extending in a direction intersecting the principal surface; plugging, among the plurality of pores, one or more pores formed in a first region; and forming a recess in a second region by a wet etching process. A high-aspect ratio structure includes a grating having a plurality of convex portions, wherein each of the plurality of convex portions is provided with a plugging member plugging a plurality of pores formed therein in a thickness direction of the structure.
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