Invention Grant
- Patent Title: Manufacturing method of liquid ejecting head chip
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Application No.: US15924725Application Date: 2018-03-19
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Publication No.: US10279591B2Publication Date: 2019-05-07
- Inventor: Hitoshi Nakayama , Takeshi Sugiyama , Daichi Nishikawa , Eriko Maeda
- Applicant: SII Printek Inc.
- Applicant Address: JP Chiba
- Assignee: SII PRINTEK INC.
- Current Assignee: SII PRINTEK INC.
- Current Assignee Address: JP Chiba
- Agency: Brinks Gilson & Lione
- Priority: JP2017-056389 20170322
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14 ; C23C18/16 ; C23C18/32 ; C23C18/42 ; G03F7/16 ; H01L41/047 ; H01L41/09 ; H01L41/29 ; H01L41/187

Abstract:
A discharge channel and a non-discharge channel are formed to have a similar shape, that is, to include extension portions and raise-and-cut portions continuing from end portions of both the extension portions, respectively. Then, imparting of a catalyst, washing of an unnecessary catalyst, plating, and the like are performed on a target surface, as a plating step. In an embodiment, an electrode clearance groove is formed after the plating step. Since channel grooves for the discharge channel and the non-discharge channel have a similar shape, it is possible to cause a water flow to uniformly flow in the channels when washing is performed, and thus to avoid an occurrence of a situation in which a lump is formed in the channel groove by plating.
Public/Granted literature
- US20180272714A1 MANUFACTURING METHOD OF LIQUID EJECTING HEAD CHIP Public/Granted day:2018-09-27
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