Invention Grant
- Patent Title: Manufacturing method of light emitting device
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Application No.: US15271086Application Date: 2016-09-20
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Publication No.: US10279552B2Publication Date: 2019-05-07
- Inventor: Motoyuki Tanaka , Yosuke Tsuchiya , Hiroyuki Tajima
- Applicant: TOYODA GOSEI CO., LTD.
- Applicant Address: JP Kiyosu-Shi, Aichi-Ken
- Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee Address: JP Kiyosu-Shi, Aichi-Ken
- Agency: McGinn I. P. Law Group, PLLC
- Priority: JP2015-191679 20150929
- Main IPC: B29D11/00
- IPC: B29D11/00 ; B29C45/00 ; H01L21/56 ; H01L33/56 ; B29C45/14 ; B29C45/26

Abstract:
A manufacturing method of a side view type light emitting device including a package body made of a synthetic resin material, the manufacturing method includes: providing an injection molding mold, for injection-molding the package body, including: a first mold provided with a first convex part for forming an upper surface side flat part on an upper surface of the package body; and a second mold provided with a first concave part for forming the upper surface side flat part; and fitting the first concave part around the first convex part so as to enter a liquid tight state with no space, injecting the synthetic resin material into each of the first and second molds so as to be filled therein, and hardening the synthetic resin material to form the package body in a state in which the first mold and the second mold are aligned with each other.
Public/Granted literature
- US20170087751A1 MANUFACTURING METHOD OF LIGHT EMITTING DEVICE Public/Granted day:2017-03-30
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