A slit opening of a slit nozzle extends unidirectionally in a longitudinal direction from near the center of a circular substrate to near an outer edge of the substrate, and has a length in the longitudinal direction equal to or smaller than a radius of the substrate. When the slit nozzle discharges chemical onto the substrate, a rotary holder rotates the substrate and the slit nozzle relatively to each other about the center of the substrate. Accordingly, the chemical from the slit nozzle all adheres to a surface of the substrate to form an excellent liquid column and a chemical film on an almost entire surface of the substrate along the outer edge of the circular substrate. This yields satisfactory coating of the substrate with the chemical while waste chemical is suppressed.