Invention Grant
- Patent Title: FinFET device and method of forming the same
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Application No.: US15878836Application Date: 2018-01-24
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Publication No.: US10263096B1Publication Date: 2019-04-16
- Inventor: Chun-Liang Kuo , Tsang-Hsuan Wang , Yu-Ming Hsu , Tsung-Mu Yang , Ching-I Li
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L21/02 ; H01L27/11 ; H01L27/088 ; H01L29/08 ; H01L29/16 ; H01L29/24 ; H01L21/8234 ; H01L21/311

Abstract:
A FinFET device includes a substrate, first and second fins, first and second gates and first and second epitaxial layers. The substrate has a first region and a second region. The first and second fins are on the substrate respectively in the first and second regions. In an embodiment, the number of the first fins is different from the number of the second fins. The first and second gates are on the substrate and respectively across the first and second fins. The first epitaxial layers are disposed in first recesses of the first fins adjacent to the first gate. The second epitaxial layers are disposed in second recesses of the second fins adjacent to the second gate. In an embodiment, the maximum width of the first epitaxial layers is L1, the maximum width of the second epitaxial layers is L2, and (L2−L1)/L1 is equal to or less than about 1%.
Information query
IPC分类: