Invention Grant
- Patent Title: Solid state image pickup device and method of producing solid state image pickup device
-
Application No.: US15858204Application Date: 2017-12-29
-
Publication No.: US10263033B2Publication Date: 2019-04-16
- Inventor: Takashi Abe , Nobuo Nakamura , Keiji Mabuchi , Tomoyuki Umeda , Hiroaki Fujita , Eiichi Funatsu , Hiroki Sato
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2002-076081 20020319
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/544 ; H01L31/0216 ; H01L31/0232

Abstract:
Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for the registration mark. Thereafter, the registration mark is read from the back-side by use of red light or near infrared rays, and registration of the stepper is accomplished. It is also possible to form a registration mark in a silicon oxide film on the back-side (illuminated side) in registry with the registration mark on the wiring side, and to achieve the desired registration by use of the registration mark thus formed.
Public/Granted literature
- US20180122849A1 SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING SOLID STATE IMAGE PICKUP DEVICE Public/Granted day:2018-05-03
Information query
IPC分类: