Aspects of the disclosure provide a chip package that includes a first die and a second die. The first die has a processing circuit and a first interface circuit. The second die is disposed in a proximity to the first die and coupled to the first die. The second die includes internal functional circuits, two or more second interface circuits with an identical configuration, and a switch circuit. A specific second interface circuit is electrically connected to the first interface circuit via wires. The switch circuit is configured to select the specific second interface circuit from the two or more second interface circuits, and couple the specific second interface circuit to the internal functional circuits on the second die.