Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US15523246Application Date: 2015-09-10
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Publication No.: US10262798B2Publication Date: 2019-04-16
- Inventor: Takashi Sasaki
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP2014-218829 20141028
- International Application: PCT/JP2015/075666 WO 20150910
- International Announcement: WO2016/067767 WO 20160506
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G2/06 ; H01G4/005

Abstract:
In an embodiment of a multilayer electronic component, one main electrode part 12a of the first external electrode 12 present on one height-direction face of the capacitor body 11 of the multilayer capacitor is partially opposed to the other main electrode part 13a of the second external electrode 13 present on the other height-direction face, while one main electrode part 13a of the second external electrode 13 present on one height-direction face of the capacitor body 11 is partially opposed to the other main electrode part 12a of the first external electrode 12 present on the other height-direction face of the capacitor body 11, and margin areas MR1 to MR4 of roughly belt shape exist between each of the opposing areas OR and each of the edges on both height-direction faces of the capacitor body 11.
Public/Granted literature
- US20170323726A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2017-11-09
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