Invention Grant
- Patent Title: Assembling component and assembling method thereof
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Application No.: US15611794Application Date: 2017-06-02
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Publication No.: US10257968B2Publication Date: 2019-04-09
- Inventor: Tzu-Chieh Huang , Hsu-Lung Lai , Tsung-Ming Lee
- Applicant: Wistron Corporation
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW106106349A 20170224
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
An assembling component includes a frame and a cover. The frame has an opening, a first plane, and a first assembling structure. The first plane surrounds and is adjacent to the opening. An area of the opening is larger than an area of the first plane. The first assembling structure is formed on the first plane. The cover covers the opening and the first plane and has a second assembling structure. A side of the cover has a second plane parallel to the first plane. The second assembling structure is formed on the second plane. An end of the second assembling structure extends from the second plane toward another side of the cover. The second assembling structure is assembled with the first assembling structure to stop the cover from moving relative to the frame.
Public/Granted literature
- US20180249598A1 ASSEMBLING COMPONENT AND ASSEMBLING METHOD THEREOF Public/Granted day:2018-08-30
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