Invention Grant
- Patent Title: Substrate-free interconnected electronic mechanical structural systems
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Application No.: US15854917Application Date: 2017-12-27
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Publication No.: US10257951B2Publication Date: 2019-04-09
- Inventor: Ian Hovey , J. Robert Reid , David Sherrer , Will Stacy , Ken Vanhille
- Applicant: Nuvotronics, INC
- Applicant Address: US VA Radford
- Assignee: NUVOTRONICS, INC
- Current Assignee: NUVOTRONICS, INC
- Current Assignee Address: US VA Radford
- Agency: Dann, Dorfman, Herrell & Skillman, P.C.
- Agent Niels Haun
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K7/02 ; H01P1/04 ; H01P3/06 ; H01P5/12
Abstract:
Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.
Public/Granted literature
- US20180153055A1 SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS Public/Granted day:2018-05-31
Information query
