Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15570834Application Date: 2016-07-22
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Publication No.: US10256234B2Publication Date: 2019-04-09
- Inventor: Hiromitsu Tanabe , Kenji Kouno
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2015-163924 20150821
- International Application: PCT/JP2016/071515 WO 20160722
- International Announcement: WO2017/033636 WO 20170302
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L29/00 ; H01L27/06 ; H01L29/739 ; H01L29/78 ; H01L21/22 ; H01L29/10 ; H01L29/32 ; H01L27/07 ; H01L21/00 ; H01L21/265

Abstract:
A semiconductor device includes a semiconductor substrate provided with an IGBT cell having a collector region and a diode cell having a cathode region, a first defect layer and a second defect layer in a drift region. A region present in the drift region and surrounded by an interface between the IGBT cell and the diode cell orthogonal to a first principal plane, and a plane passing through a boundary between the collector region and the cathode region on a boundary line along an interface between the collector region and the drift region and crossing the first principal plane at an angle of 45 degrees is referred to as a boundary region. The diode cell satisfies a relationship of SD1>S, in which S is an area occupied by the boundary region and SD1 is an area occupied by the diode cell in a surface of the drift region.
Public/Granted literature
- US20180151557A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-05-31
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