Invention Grant
- Patent Title: Component temperature control using a combination of proportional control valves and pulsed valves
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Application No.: US13652257Application Date: 2012-10-15
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Publication No.: US10256123B2Publication Date: 2019-04-09
- Inventor: Chetan Mahadeswaraswamy
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: C23F1/08
- IPC: C23F1/08 ; F28F27/02 ; H01L21/67

Abstract:
Methods and systems for controlling temperatures in plasma processing chamber with a combination of proportional and pulsed fluid control valves. A heat transfer fluid loop is thermally coupled to a chamber component, such as a chuck. The heat transfer fluid loop includes a supply line and a return line to each of hot and cold fluid reservoirs. In an embodiment, an analog valve (e.g., in the supply line) is controlled between any of a closed state, a partially open state, and a fully open state based on a temperature control loop while a digital valve (e.g., in the return line) is controlled to either a closed state and a fully open state.
Public/Granted literature
- US20130105084A1 COMPONENT TEMPERATURE CONTROL USING A COMBINATION OF PROPORTIONAL CONTROL VALVES AND PULSED VALVES Public/Granted day:2013-05-02
Information query
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