Invention Grant
- Patent Title: Coil electronic component and method for manufacturing the same
-
Application No.: US14988924Application Date: 2016-01-06
-
Publication No.: US10256039B2Publication Date: 2019-04-09
- Inventor: You Na Kim , Moon Soo Park , Min Hee Kim , Jong Ho Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR10-2015-0032374 20150309
- Main IPC: H01F27/02
- IPC: H01F27/02 ; H01F41/04 ; H01F17/00 ; H01F27/255
Abstract:
A coil electronic component includes: a coil part; an insulating layer covering the coil part; a magnetic body enclosing the coil part covered by the insulating layer; and an adhesive layer disposed between the insulating layer and the magnetic body to prevent chipping of the magnetic body.
Public/Granted literature
- US20160268040A1 COIL ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-09-15
Information query
