Invention Grant
- Patent Title: Cooling element for electronic components and electronic device
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Application No.: US15336046Application Date: 2016-10-27
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Publication No.: US10251305B2Publication Date: 2019-04-02
- Inventor: Pertti Seväkivi , Niko Björkman , Juha Viljasalo
- Applicant: ABB Technology Oy
- Applicant Address: CH Baden
- Assignee: ABB Schweiz AG
- Current Assignee: ABB Schweiz AG
- Current Assignee Address: CH Baden
- Agency: Taft Stettinius & Hollister LLP
- Agent J. Bruce Schelkopf
- Priority: EP15191675 20151027
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/473 ; H01L25/07

Abstract:
A cooling element comprising a cooling body, the cooling body comprising a first surface and a second surface, the first surface and the second surface being on the opposing sides of the body and the distance between the first and second surfaces defining the height of the cooling body, multiple of channels for cooling liquid arranged inside the cooling body, the channels extending in a longitudinal direction of the cooling body, wherein the channels are arranged in two layers in the direction of the height of the cooling body inside the cooling body and the cooling element is adapted to hold electronic components on the first surface and on the second surface for cooling electronic components on both surfaces.
Public/Granted literature
- US20170118868A1 COOLING ELEMENT FOR ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE Public/Granted day:2017-04-27
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