Invention Grant
- Patent Title: Bus bar module
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Application No.: US14285779Application Date: 2014-05-23
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Publication No.: US10249865B2Publication Date: 2019-04-02
- Inventor: Shigeyuki Ogasawara , Shinichi Yanagihara
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-111111 20130527
- Main IPC: H01M2/20
- IPC: H01M2/20

Abstract:
A bus bar module includes: a plurality of bus bar cases each housing a bus bar; a first engagement portion provided to one of the plurality of bus bar cases; a first connecting member having flexibility and connecting the plurality of bus bar cases; a plurality of insulating covers covering openings of the plurality of bus bar cases, the insulating covers including a second engagement portion to be engaged with the first engagement portion; a second connecting member having flexibility and connecting the plurality of insulating covers; and a pair of ribs provided to extend downward from an inner surface of each of the insulating covers located adjacent to each other.
Public/Granted literature
- US20140349165A1 BUS BAR MODULE Public/Granted day:2014-11-27
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