Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15854236Application Date: 2017-12-26
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Publication No.: US10249723B2Publication Date: 2019-04-02
- Inventor: Heimo Hofer , Martin Poelzl , Maximilian Roesch , Britta Wutte
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L21/763
- IPC: H01L21/763 ; H01L29/417 ; H01L29/40 ; H01L29/423 ; H01L29/78 ; H01L29/66 ; H01L29/739

Abstract:
A semiconductor device includes a semiconductor body having a main surface and an active region surrounded by a non-active region. A trench extends from the main surface into the semiconductor body. The trench has a stripe configuration and extends laterally within the active region. A first electrode and a first insulator are in the trench. The first insulator insulates the first electrode from the semiconductor body. The first electrode is recessed in the trench and has a planar surface extending generally parallel with and below the main surface of the semiconductor body so as to define a well in the trench that is laterally confined by the first insulator. A second insulator is on the planar surface. A second electrode is within the well of the trench, and the second insulator insulates the second electrode from the first electrode.
Public/Granted literature
- US20180138278A1 Semiconductor Device Public/Granted day:2018-05-17
Information query
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