Invention Grant
- Patent Title: Manufacturing methods of array substrates and array substrates
-
Application No.: US15117446Application Date: 2016-07-20
-
Publication No.: US10249648B2Publication Date: 2019-04-02
- Inventor: Zhichao Zhou , Hui Xia
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201610479540 20160627
- International Application: PCT/CN2016/090583 WO 20160720
- International Announcement: WO2018/000477 WO 20180104
- Main IPC: H01L27/12
- IPC: H01L27/12 ; G02F1/1368 ; H01L21/77

Abstract:
The present disclosure relates to an array substrate and the manufacturing method thereof. The manufacturing method includes the steps including: forming a buffer layer on a substrate, forming a source and a data line within the buffer layer, and forming a gate and a gate line on the buffer layer, forming an insulation layer on the source, the data line, the gate, and the gate line, forming a semiconductor layer on the source, and forming a first pixel electrode and a second pixel electrode on the insulation layer. The manufacturing efficiency of the manufacturing process of the array substrate is high, and the manufacturing process is also energy saving.
Public/Granted literature
- US20180204852A1 MANUFACTURING METHODS OF ARRAY SUBSTRATES AND ARRAY SUBSTRATES Public/Granted day:2018-07-19
Information query
IPC分类: