Invention Grant
- Patent Title: MISHFET and Schottky device integration
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Application No.: US14594286Application Date: 2015-01-12
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Publication No.: US10249615B2Publication Date: 2019-04-02
- Inventor: Bruce M. Green , James A. Teplik
- Applicant: Bruce M. Green , James A. Teplik
- Applicant Address: US TX Austin
- Assignee: NXP USA, INC.
- Current Assignee: NXP USA, INC.
- Current Assignee Address: US TX Austin
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/423 ; H01L29/66 ; H01L29/778 ; H01L29/812 ; H01L21/8258 ; H01L27/088 ; H01L29/78 ; H01L29/20 ; H01L29/51

Abstract:
A semiconductor device includes a substrate comprising a heterostructure configured to support formation of a channel during operation, first and second dielectric layers supported by the substrate, the second dielectric layer being disposed between the first dielectric layer and the substrate, a gate supported by the substrate, disposed in a first opening in the first dielectric layer, and to which a bias voltage is applied during operation to control current flow through the channel, the second dielectric layer being disposed between the gate and the substrate, and an electrode supported by the substrate, disposed in a second opening in the first and second dielectric layers, and configured to establish a Schottky junction with the substrate.
Public/Granted literature
- US20150123168A1 MISHFET AND SCHOTTKY DEVICE INTEGRATION Public/Granted day:2015-05-07
Information query
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