Invention Grant
- Patent Title: Method for manufacturing input assembly, input assembly and terminal
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Application No.: US15627287Application Date: 2017-06-19
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Publication No.: US10248251B2Publication Date: 2019-04-02
- Inventor: Shoukuan Wu , Zanjian Zeng
- Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Applicant Address: CN Dongguan, Guangdong
- Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP.
- Current Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP.
- Current Assignee Address: CN Dongguan, Guangdong
- Agency: Hodgson Russ LLP
- Priority: CN201610676740 20160816; CN201620889082U 20160816
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06K9/00 ; G06F21/32 ; G06F3/041

Abstract:
A method for manufacturing an input assembly, an input assembly and a terminal are provided. The input assembly includes a reinforcing plate, a first flexible circuit board, a fingerprint chip package structure and a fixed plate. The reinforcing plate has a first positioning structure and configured to reinforce the first flexible circuit board and the fingerprint chip package structure. The first flexible circuit board is fixed on the reinforcing plate. The fingerprint chip package structure is fixed on the first flexible circuit board. The fixed plate is fixed to the terminal and has a second positioning structure. The first positioning structure is configured to be fitted with the second positioning structure, so as to limit a movement of the reinforcing plate relative to the fixed plate.
Public/Granted literature
- US20180052561A1 METHOD FOR MANUFACTURING INPUT ASSEMBLY, INPUT ASSEMBLY AND TERMINAL Public/Granted day:2018-02-22
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